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Flexible Printed Circuit Board Product List and Ranking from 16 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

Flexible Printed Circuit Board Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. Fujikura Electronic Components and Connectors Division Tokyo//Ferrous/Non-ferrous metals
  4. 4 丸和製作所 Miyagi//Electronic Components and Semiconductors
  5. 5 キヤノン・コンポーネンツ 電子回路事業部 Saitama//Electronic Components and Semiconductors
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Flexible Printed Circuit Board Product ranking

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. High Heat Resistance Heat Dissipation Flexible Circuit Board (FPC) *Compatible with 150°C environments 山下マテリアル
  2. [Use Case] Achieving 'Future Co-Creation' between Humans and Robots with Automation Solutions 太洋テクノレックス 本社　和歌山
  3. FPC forming (bending) delivery 山下マテリアル
  4. 4 Membrane rubber implementation Fujikura Electronic Components and Connectors Division
  5. 5 Specification for filling holes! "Ultra-small diameter through hole." 山下マテリアル

Flexible Printed Circuit Board Product List

1～30 item / All 37 items

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Flexible printed circuit board (FPC). Bendable!

Flexible printed circuit board (FPC). Bendable!

Conducting electrical inspections and comprehensive inspections! Laminates are available up to a maximum size of 500mm × 2000mm.

The product is a flexible printed circuit board that can be bent. It is compact, thin, and lightweight, allowing for a reduction in connections with connectors that can be integrated into small spaces. It can be used in digital cameras, laptops, smartphones, printers, and other small devices. We provide a detailed introduction to the manufacturing process in the PDF document, so please download and take a look. 【Features】 ■ Flexible and bendable ■ Reduces connections with connectors that can be integrated into small spaces ■ Compact, thin, and lightweight *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Flexible Printed Circuit Board

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Flexible printed circuit board

Flexible printed circuit board

Flexible printed circuit boards with high design freedom are our specialty. We can accommodate designs using customer-specified materials.

We will prepare your preferred printed circuit board! Our flexible printed circuit boards, known for their high design freedom, are suitable for mass production. You can view our flexible printed circuit boards by downloading the catalog. → If you are considering mass production, please contact us.

  • Printed Circuit Board
  • Flexible Printed Circuit Board

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Okin Electric Wire Co., Ltd. Flexible Printed Circuit Board (FPC) Catalog

Okin Electric Wire Co., Ltd. Flexible Printed Circuit Board (FPC) Catalog

A rich lineup tailored to various applications! Featuring flexible printed circuit boards!

This catalog features the "Flexible Printed Circuit Boards (FPC)" from Okiden Cable Co., Ltd. Our products are printed circuit boards designed to be bendable, using a thin insulating material (plastic film) as the substrate. They can accommodate component mounting and can be used as connection wiring. In addition to standard products, we offer "High-Flex FPC" that demonstrates excellent bending performance even in narrow spaces, and "Self-Supporting Sliding FPC" that can bend while standing in mid-air. 【Featured Products (Partial)】 ■ Standard Products (Single-Sided FPC, Double-Sided FPC, Flex-Rigid) ■ High-Flex FPC ■ High-Speed Transmission FPC ■ Long-Length FPC ■ Long-Length High-Speed Transmission FPC *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Flexible Printed Circuit Board

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Flexible printed circuit board [Reel to Reel method]

Flexible printed circuit board [Reel to Reel method]

We can accommodate everything from mass production to small-batch, diverse production! We contribute to the miniaturization and slimness of modules, expanding design flexibility!

We would like to introduce our "Flexible Printed Circuit Board Production." With the "Reel to Reel Method," we achieve high productivity through automation, including feeding and winding, and can produce high-quality TAB/COF using a non-contact method that minimizes human intervention. Additionally, we also conduct production in sheet form, allowing us to meet a wide range of customer demands. 【Features】 ■ Capable of producing from mass production to small quantities of various types - Supported by both reel to reel method and sheet production ■ Production of high-density fine wiring flexible substrates ■ Line/Space: Below 30μm pitch ■ VIA hole filling copper plating *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Other electronic parts
  • Flexible Printed Circuit Board

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Ground slit MSL structure flexible printed circuit board

Ground slit MSL structure flexible printed circuit board

The thinning of flexible substrates is effective for assembly in narrow spaces! Required in areas where low spring back and high bending flexibility are needed.

Achieving Thinness While Maintaining Transmission Characteristics! 【Features】 ■ This technology resolves the relationship between the thickness of the FPC and conductor loss, which is a challenge of microstrip lines. ■ By incorporating a slit design in the ground (GND) plane, it is expected to achieve a thinner FPC while maintaining transmission characteristics. ■ A 0mm slit processing is applied between patterns, accommodating a bendable 'slit shape'. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • High frequency/microwave parts
  • Wiring materials
  • Flexible Printed Circuit Board

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YFC "LVDS Type Coplanar (RFC)"

YFC "LVDS Type Coplanar (RFC)"

Co-planar structure with unilateral wiring! We have two types of lineup available.

The "LVDS Type Coplanar (RFC)" is a high-performance type of the YFC series. It uses liquid crystal polymer, which is a low dielectric constant material, for the base film to reduce transmission loss. There are two types available: one that uses polyimide film for insulation (RFC1) and another that uses liquid crystal polymer film (RFC2). Additionally, due to its coplanar structure with single-sided wiring, it offers the greatest flexibility among our LVDS-compatible flat cables. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ Offers the greatest flexibility among LVDS types due to single-sided wiring *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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YFC "Type with Shield (SFC)"

YFC "Type with Shield (SFC)"

Excellent flexibility! An essential item in situations where EMC measures are necessary.

The "L Shielded Type (SFC)" is equipped with a shield film applied to our YFC. An essential item in scenes where EMC measures are required. The shield film uses a thin membrane, ensuring that flexibility is not compromised. 【Features】 ■ YFC cable using shield film ■ Utilizes thin film shielding ■ Excellent flexibility *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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YFC "LVDS Type Strip Line (RFS)"

YFC "LVDS Type Strip Line (RFS)"

Improved bending performance with the adoption of mesh GND! EMC measures are implemented with a shielding film.

The "LVDS Type Strip Line (RFS)" uses liquid crystal polymer, a low dielectric material, as the base film, aiming to reduce transmission loss. Additionally, it is suitable for EMC measures due to the use of a shielding film. The adoption of a mesh ground improves flexibility. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ Implements EMC measures with a shielding film ■ Improves bending performance through the adoption of a mesh ground *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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YFC "LDVS Type Microstrip Line (RFM)"

YFC "LDVS Type Microstrip Line (RFM)"

Improved flexibility with the adoption of mesh GND! Compatible with manual soldering as well.

The "LDVS Type Microstrip Line (RFM)" is a high-performance version of the popular YFC series. It uses liquid crystal polymer (LCP), a low dielectric constant material, as the base film to reduce transmission loss. There are types ranging from RFM1 to RFM4, so please check the catalog for details. We offer two types for insulation: one using liquid crystal polymer film and the other using polyimide film. The type using liquid crystal polymer film for insulation aims for further reduction in transmission loss. Please choose according to the scene in which you will be using it. 【Features】 ■ Reduces transmission loss by using liquid crystal polymer as the base ■ The type using polyimide for the coverlay can accommodate hand soldering ■ Improved bending performance due to the adoption of mesh GND *For more details, please refer to the PDF materials or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

Reduce reflection points! "Multilayer flexible substrate for high-speed transmission"

It is suitable for high-frequency applications in the tens of GHz range, and because it allows for high-density RF lines compared to PCBs, it is effective for miniaturizing products.

The "high-speed transmission multilayer flexible substrate" reduces reflection points by integrating FPC and rigid substrates. It is suitable for high-frequency applications in the 10-30GHz range and allows for high-density RF lines compared to rigid substrates, making it effective for miniaturization of products. It also supports wire bonding and can have metal or ceramic reinforcement plates attached for heat dissipation measures. 【Features】 ■ Heat dissipation measures can be implemented by attaching reinforcement plates made of metal or ceramics ■ Miniaturization is possible due to high-density RF lines ■ Compatible with wire bonding *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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Space-saving with increased winding count! 'Multilayer Coil Flexible Circuit Board'

Space-saving with increased winding count! 'Multilayer Coil Flexible Circuit Board'

It can carry a larger current than a standard flexible circuit board, making it suitable for use in motors, power supply coils, and sensors.

The "multi-layer coil flexible substrate" has a conductor thickness of 75μm to 90μm, making it suitable for high current applications compared to standard flexible substrates. It allows for increased winding numbers in a compact space, making it promising for use in motors, power supply coils, and sensor applications. Additionally, it can be bent and integrated into narrow spaces, achieving a flat, thin, and lightweight design. 【Features】 ■ Possible to increase winding numbers in a compact space ■ Achieves a flat, thin, and lightweight design ■ Can be bent and integrated into narrow spaces ■ Expected to be used in motors, power supply coils, and sensor applications *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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BigElec Fold - High Current Flexible Circuit Board - New Product

BigElec Fold - High Current Flexible Circuit Board - New Product

BigElec Fold - Customize flexible high-current wiring at a reasonable price.

BigElec Fold is a flexible and cost-effective high-current wiring solution that serves as an alternative to busbars and wire harnesses. ■ Features - Thin and flat printed circuit board structure - Customizable according to the desired shape and applied current of the customer - Two-layer construction allows for cost reduction and bending processing BigElec Fold emphasizes cost performance by limiting itself to a two-layer structure instead of a multi-layer one. This reduces material costs and makes bending processing easier, allowing for folding as well. BigElec Fold can connect to multiple terminals in its flat state, and by folding the wiring, it can also be accommodated in tight spaces. It can be freely designed and folded according to the application and wiring space. It realizes innovative ideas in the design field and provides excellent cost performance. BigElec Fold paves the way for the next stage of high-current wiring and meets customer expectations.

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  • Printed Circuit Board
  • Flexible Printed Circuit Board

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Maruwa Manufacturing Co., Ltd. Business Introduction

Maruwa Manufacturing Co., Ltd. Business Introduction

Specialized manufacturer of flexible printed circuit boards (FPC)!

Maruwa Manufacturing Co., Ltd. is a company primarily engaged in the manufacturing and sales of flexible printed circuit boards (FPC). Our products are used in various applications such as space and aerospace equipment, as well as medical devices. To meet diverse needs, we possess advanced technologies for high-density FPC formation and thin FPC formation, and with our extensive experience and production techniques, we provide timely FPC solutions that satisfy our customers. For any inquiries regarding flexible printed circuit boards (FPC), please feel free to consult with us. [Business Activities] ■ Manufacturing and sales of flexible printed circuit boards (FPC) *For more details, please refer to our catalog or feel free to contact us.

  • Other electronic components and modules
  • Other Machine Parts
  • Flexible Printed Circuit Board

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[Use Case] Achieving 'Future Co-Creation' between Humans and Robots with Automation Solutions

[Use Case] Achieving 'Future Co-Creation' between Humans and Robots with Automation Solutions

FA and automation systems, introduction of operational examples. "Future co-creation" between humans and robots.

〇 Introduction of Use Cases We have introduced our proposed automation system in the customer's PR video. We have received consent for its publication on this site, so please view it via the video link. Our automation system: 13-23 seconds, 38-49 seconds *Only the input and output of materials using a dual-arm robot transport system. Elephantech Inc. https://www.elephantech.co.jp/ Elephantech "Elephantech - A startup leading the world in FPC printing" With the mission of "creating a sustainable world through the power of new manufacturing," we manufacture and sell FPC (Flexible Printed Circuit) using environmentally friendly unique methods with inkjet printing and copper plating.

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  • SCARA Robot
  • Flexible Printed Circuit Board

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Manufacturing of Flexible Circuit Boards *Product Achievements Introduction

Manufacturing of Flexible Circuit Boards *Product Achievements Introduction

Are you facing any issues with flexible substrates? We have extensive experience in various fields, including medical devices and automotive control systems.

This is an introduction to our "Flexible Circuit Board Manufacturing." "Flexible Printed Circuit Boards" are used in applications such as communication devices and measurement instruments, and we handle various types including "Single-Sided FPC," "Double-Sided FPC," and "Rigid-Flex." Materials used include polyimide and polyester. For "Multilayer Flex" and "Rigid-Flex," we collaborate with partner companies for production. *For questions or inquiries, please call us or contact us at the email address below. 042-774-4555 stay-4555@staydenshi.jp Contact Person: Kumada, Kikuchi 【Product Achievements (Excerpt)】 ■ Flexible for ultrasound diagnostic probes ■ Flexible for motor field winding (for high electromagnetic field generation) ・Source: Gunma University ■ Flexible for superconducting devices operating at -269℃ (for superconducting circuit evaluation) ・Main Source: Yokohama National University *For more details, please refer to the PDF document or feel free to contact us.

  • Board to FPC connector
  • Flexible Printed Circuit Board

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High-precision multilayer flexible printed circuit board (MFS Technology)

High-precision multilayer flexible printed circuit board (MFS Technology)

We handle products from MFS Technology, which has many actual deliveries in mobile and automotive displays!

MFS Technology was founded in 1989 and is headquartered in Singapore, being an FPC manufacturer with a significant track record of deliveries for mobile and automotive displays. Additionally, it is a PCB manufacturer primarily focused on heavy copper. *You can download the English version of the catalog. *For more details, please refer to the PDF materials or feel free to contact us.

  • Other electronic parts
  • Flexible Printed Circuit Board

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Flexible Printed Circuit Board (FPC)

Flexible Printed Circuit Board (FPC)

Flexible printed circuit board (FPC) for high-speed transmission

This product is an FPC designed for high-speed transmission. It uses a special liquid crystal polymer as the base film, featuring stable impedance control. We can also accommodate component mounting and procurement for FPCs, as well as supply components from customers. We offer total proposals from pattern design to mass production. We can also provide various environmental documentation. CMI is an FPC manufacturer with over 15 years of history in Taiwan. We have numerous achievements with domestic manufacturers in Japan, realizing high quality, low cost, and short delivery times based on our advanced technology and track record.

  • Wiring materials
  • Other machine elements
  • cable
  • Flexible Printed Circuit Board

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FPC/Flexible Printed Circuit Board

FPC/Flexible Printed Circuit Board

Short delivery times and small lot sizes! Supports high-quality and high-performance specifications such as high flexibility and impedance control.

Asunics collaborates with Taiwanese FPC manufacturers to provide high-quality and short-lead-time FPCs. We support high-quality and high-performance specifications such as high flexibility and impedance control. We provide speedy support from component mounting, bump and Gerber data creation assistance, to prototyping and mass production. 【Features】 ■ Materials: Polyimide / Liquid Crystal Polymer, etc. ■ High-speed signal support: LVDS / HDMI / USB / MIPI ■ Short lead time / Small lot *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Flexible Printed Circuit Board

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Introduction of high-performance FPC made in China

Introduction of high-performance FPC made in China

Flexible printed circuit boards with high quality and technology achieved at low prices through guidance from a Japanese team.

Strict calibration of equipment and completion of UL certification for materials. Suzhou Zhengxin Electronic Technology Co., Ltd. maximizes the above features to provide customers with both "Japanese standard" quality and responsiveness, as well as "Chinese standard" pricing. ＝＝＝＝＝You can also view samples of FPC in the electronic book below＝＝＝＝＝

  • Other semiconductors
  • Flexible Printed Circuit Board

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Flexible Printed Circuit Board (FPC) "Long-Length High-Speed Transmission FPC"

Flexible Printed Circuit Board (FPC) "Long-Length High-Speed Transmission FPC"

Achieves a transmission distance more than three times that of a typical high-speed transmission FPC!

The "Long-Length High-Speed Transmission FPC" is a flexible printed circuit board (FPC) that enables the transmission of high-speed signals over long distances, achieved through the fusion of our long-length technology and high-speed transmission technology. It can be used for high-speed signal transmission wiring in large equipment and is also adopted in astronomical observation devices. 【Features】 ■ Transmission distance is more than three times that of typical high-speed transmission FPCs. ■ Enables long-length high-speed transmission comparable to cables while maintaining the thinness and lightness of FPCs. ■ By using low-breakage materials and unique pattern design, it can transmit up to 1 meter under the "USB3.0" standard. ■ Supports measurement of various transmission characteristics such as characteristic impedance, loss, and crosstalk. *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring materials
  • Flexible Printed Circuit Board

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High Current Flexible Circuit Board [*FPC Technology Catalog Available]

High Current Flexible Circuit Board [*FPC Technology Catalog Available]

Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.

Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

  • Printed Circuit Board
  • Flexible Printed Circuit Board

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Card edge compatible multi-layer separated flexible printed circuit board (FPC)

Card edge compatible multi-layer separated flexible printed circuit board (FPC)

Can be used with bent shapes and supports high-speed transmission! Ideal for integration in tight spaces. Integration of connections between circuit boards is also possible. *There is a video that explains it in 2 minutes!

The "Card Edge Compatible Multi-Layer Flexible Printed Circuit Board (FPC)" provided by our company is a multi-layer flexible circuit board designed to accommodate card edge connectors with double-sided contacts. By reducing the connection points between printed circuit boards and flexible circuit boards, a stable impedance line is formed, which is expected to improve signal integrity at high frequencies of 10 GHz and above. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, making it suitable for installation in tight spaces. 【Features】 ■ A partially bendable structure that has similar functionality to rigid-flex boards, enabling the formation of highly reliable vias. ■ A structure that integrates flexible and rigid parts without connection points or via transitions, allowing for the formation of stable impedance lines. ■ High-density wiring is possible with 100μm pitch wiring and vias with a land diameter of 300μm or less. ■ Integration of connections between boards contributes to a reduction in assembly labor. *For more details, please refer to the PDF materials. Feel free to contact us with any inquiries.

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  • Board to FPC connector
  • Flexible Printed Circuit Board

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High-temperature resistant and oil-resistant flexible printed circuit board (FPC)

High-temperature resistant and oil-resistant flexible printed circuit board (FPC)

Compared to polyimide, it has low dielectric constant, low dielectric loss tangent, and low water absorption, resulting in excellent high-frequency transmission characteristics! It also has long-term heat resistance of 240°C.

The "High-Temperature Durable and Oil-Resistant Flexible Printed Circuit Board (FPC)" made entirely of LCP substrate excels in long-term heat resistance and passes the flexibility test (AB test) equivalent to MOT 180°C required by UL standards. Additionally, it has better high-frequency transmission characteristics due to its low dielectric constant, low dielectric loss, and low water absorption compared to polyimide. In the oil resistance test, there were almost no changes in conduction resistance and appearance before and after the test, and the conductor peel-off test also met the standard values. 【Features】 ■ Uses liquid crystal polymer (LCP) for the base and cover materials ■ Has long-term heat resistance of 240°C ■ Exhibits oil resistance against engine oil, brake pedals, and ATF *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."

It's also okay to use it twisted! "Flexible substrate compatible with high-speed transmission connectors."

Supports high-speed transmission up to 15GHz! We have combined the high-speed transmission connectors from Irisoh Electronics with our flexible substrates.

The "Flexible substrate compatible with high-speed transmission connectors" combines the high-speed transmission connectors from Irisoh Electronics, [IMSA-11600S-30Y900 and IMSA-11501S-30Y900], with our YFC series (LVDS type microstrip line) RFM. By integrating them, it supports high-speed transmission up to 15GHz. 【Features】 ■ The LVDS-compatible FPC has been slotted. ■ It is easy to bend and can also be twisted for use. *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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High Heat Resistance Heat Dissipation Flexible Circuit Board (FPC) *Compatible with 150°C environments

High Heat Resistance Heat Dissipation Flexible Circuit Board (FPC) *Compatible with 150°C environments

It can suppress discoloration during heating. Here are the test results using a double-sided panel.

The "High Heat Resistant Radiation Flexible Printed Circuit Board (FPC)" is an FPC that uses Okitsumo's heat-resistant solder resist "TAINEX." TAINEX is suitable for high-temperature environments up to 150°C and suppresses discoloration during heating. It also achieves radiation heat dissipation, and in our heat dissipation experiments, when combined with a thermal conduction layer, it has been shown to maintain temperatures more than 30 degrees lower compared to typical resist specifications for FPCs. *This result is based on tests conducted on double-sided boards. 【Features】 ■ FPC using Okitsumo's heat-resistant solder resist "TAINEX" ■ Thermal measures: Achieves a radiation rate of over 90% *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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Achieving a thickness of 0.98mm with 12 layers! 'High-Density High-Multilayer Flexible Circuit Board'

Achieving a thickness of 0.98mm with 12 layers! 'High-Density High-Multilayer Flexible Circuit Board'

When you want to implement high-density wiring with over 200 pins in a limited space! It can be bent for use, allowing for high-density wiring in a compact space.

The "High-Density High-Multilayer Flexible Circuit Board" is an FPC developed for devices that require many signals. Despite having a 12-layer structure, it achieves a thickness of less than 1mm. The cable section can be bent for use, enabling high-density wiring in compact spaces. 【Features】 ■ The harness section can be bent for use. ■ Ideal for applying high-density wiring with over 200 pins in limited spaces. *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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Specification for filling holes! "Ultra-small diameter through hole."

Specification for filling holes! "Ultra-small diameter through hole."

It is possible to form through holes with a diameter of 25μm or less on double-sided FPC. Additionally, it is also possible to form holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm.

"Ultra-small diameter through holes" are formed with a diameter of φ20μm on both sides of the FPC through laser processing. It is possible to create holes with a minimum diameter of 20μm and a minimum pad diameter of 95μm. By using through-hole plating to fill the holes and arranging the through holes on the pattern, it enables narrower pitch and contributes to the miniaturization of the product. 【Features】 ■ Formation of through holes with a diameter of Φ25μm or less on both sides of the FPC is possible. ■ The holes are filled with 15μm through-hole plating specifications. *For more details, please refer to the PDF document or feel free to contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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Standard specification product 'BigElec (high current FPC)' for connection between terminal screws.

Standard specification product 'BigElec (high current FPC)' for connection between terminal screws.

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

BigElec is a flexible printed circuit board designed for high current wiring, intended as an alternative to busbars and wire harnesses, featuring a slim and flat design. Similar to printed circuit boards, it can accommodate pattern formation and assembly according to your requirements. We have newly introduced the "BigElec Standard Specification Products," which are easy to implement for connections between screw terminals. The BigElec Standard Specification Products have no initial costs, allowing for reduced upfront expenses. 【BigElec Standard Specification Product Specifications】 ■ Layers: 2 layers, 4 layers, 6 layers, 8 layers ■ Wiring width: 8mm to 11mm (integers only) ■ Total length: 30mm to 210mm (integers only) ■ Terminal screw diameters: M3 (hole diameter φ3.8mm), M4 (hole diameter φ4.4mm), M5 (hole diameter φ5.4mm), M6 (hole diameter φ6.5mm), M8 (hole diameter φ8.5mm) *For more details, please download the PDF or contact us.

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  • Wiring materials
  • Flexible Printed Circuit Board

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FPC forming (bending) delivery

FPC forming (bending) delivery

Bend and deliver, ready to use. Achieve labor savings and space-saving design with FPC processing!

The "FPC Forming Processing Service" provided by Yamashita Material Co., Ltd. is a service that delivers flexible printed circuit boards (FPC) manufactured by our company, pre-bent into shapes according to customer specifications. The delivered FPC is in a state ready for immediate assembly, significantly reducing the labor hours at the assembly site and contributing to space-saving design. We can accommodate custom bending shapes and sizes upon consultation. We also have numerous examples of forming that utilize flexible materials such as liquid crystal polymer (LCP) and polyimide (PI), allowing us to flexibly respond to complex shapes.

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  • Other electronic parts
  • Flexible Printed Circuit Board

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Flexible Printed Circuit Board "Low-Rebound FPC"

Flexible Printed Circuit Board "Low-Rebound FPC"

Customize softness! We offer a variety that meets low rebound needs!

We have revamped the lineup of Maruwa Manufacturing's thin FPC representative brand "MK Series" to offer variations that meet the demand for low rebound. Here are solutions for making devices thinner and more compact. 【Applications】 ○ Suppressing springback in thin LCD modules, etc. ○ Sliding applications in compact areas such as small camera modules, etc. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Flexible Printed Circuit Board

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